Edi Staff Builders

Job purpose: Process owner for wafer singulation processes including dicing, sawing and cleaving. Responsible for sustaining for existing products as well as developing new processes for new products.

Duties and responsibilities:

· Develop and sustain wafer singulation processes for multiple products and for multiple technology platforms.

· Communicate and collaborate across multiple teams including process engineering, product engineering, manufacturing, design, and failure analysis groups.

· Analyze statistical process control (SPC) data and respond appropriately to ensure processes are in control.

· Investigates and finds root cause for singulation related issues found on wafers

Qualifications:

· PhD., M.S., or B.S. in Electrical Eng., Chemical Eng., Mechanical Eng. or related fields.

· 5 or more years’ experience in characterization and processing of compound semiconductor materials.

· Experience with device fabrication especially in wafer singulation (dicing, sawing, cleaving) is preferred.

· Experience with SPC rules, control charts, and other aspects of manufacturing / operations are required.

Working conditions

Job requires working inside a wafer fab clean room

Physical requirement

This position does not require any physically demanding activities.