Bar Fab Process Engineer
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Job Description and Qualification:
Job purpose: Process owner for wafer singulation processes including dicing, sawing and cleaving. Responsible for sustaining for existing products as well as developing new processes for new products.
Duties and responsibilities:
· Develop and sustain wafer singulation processes for multiple products and for multiple technology platforms.
· Communicate and collaborate across multiple teams including process engineering, product engineering, manufacturing, design, and failure analysis groups.
· Analyze statistical process control (SPC) data and respond appropriately to ensure processes are in control.
· Investigates and finds root cause for singulation related issues found on wafers
Qualifications:
· PhD., M.S., or B.S. in Electrical Eng., Chemical Eng., Mechanical Eng. or related fields.
· 5 or more years’ experience in characterization and processing of compound semiconductor materials.
· Experience with device fabrication especially in wafer singulation (dicing, sawing, cleaving) is preferred.
· Experience with SPC rules, control charts, and other aspects of manufacturing / operations are required.
Working conditions
Job requires working inside a wafer fab clean room
Physical requirement
This position does not require any physically demanding activities.
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