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Back End of Line Processing Technician

Job Category:

Manufacturing

Job Level:

Skilled

Open Date:

20-Jan-2022

Location:

United Kingdom

Close date:

31-Jul-2022

Client Industry:

SEMICONDUCTOR/ELECTRONICS

Job Description and Qualification:

  • Work for a world-leading semiconductor manufacturing company
  • Earn competitive pay
  • Experience life in the UK


We are recruiting for II-VI in Newton Acycliffe, Durham in the United Kingdom!

II-VI Incorporated, a global leader in engineered materials and optoelectronic components, is a vertically integrated manufacturing company that develops innovative products for diversified applications in communications, industrial, aerospace & defense, semiconductor capital equipment, life sciences, consumer electronics, and automotive markets. The Company has research and development, manufacturing, sales, service, and distribution facilities worldwide. The Company produces a wide variety of application-specific photonic and electronic materials and components, and deploys them in various forms, including integrated with advanced software to support our customers.


SUMMARY OF RESPONSIBILITIES:

· Running of processing equipment including Wafer Dicing Saws, Scribe and Break, Laser Ablation, Die bond, Wire bond, Pick and Place (Wafer Reconstruction).

· Maintaining jigs and fixture in a good and working condition.

· Ensure assembly area is fit for purpose with respect to ESD, equipment calibration and diagnostics, safe use of production equipment.

· Ensuring documentation is suitable for production use.

· Maintenance of records for SPC, DOE, ESD, and training.

· Working with Engineering staff to ensure high yielding and stable processes.

· Working with production staff to ensure deadlines are met.

· To help ensure that the department operates efficiently and safely.


MAIN TASKS:

· Set up and adjustment/operation of Wafer Dicing Saws, Scribe and Break, Laser Ablation, Die bond, Wire bond, Pick and Place equipment.

· Use of Mechanical Test equipment, wire-pull, ball shear, die shear.

· Ensuring process documentation (set up and adjust, safe operation, Maintenance, SPC, OCAP etc.) and yield reporting is kept current and has the ability to produce reports from the information.

· Basic Fault-finding of processing equipment.

· Assembly process optimization and yield improvement activities

· Lot tracking, held lot investigations and writing of PCARS, reporting on lot status.

· Working with production staff to ensure production output is achieved

· Department representation at supervisors meetings.

· Use of tracking and reporting systems (WCS, MESA, WAT Dispo Etc.)


EXPERIENCE

Proven experience of working in volume semiconductor assembly area. Experience of applicable equipment. Experience using laser processing equipment. Experienced in safe use of laser products Experienced in semiconductor back end processing. 


TECHNICAL SKILLS

Practical semiconductor processing skills and dexterity Basic fault finding and troubleshooting. Analytical and problem solving ability. Computer literacy. 


PERSONAL QUALITIES

Pro-active and capable of working without direct supervision. Prepared to be flexible in working hours to suit business needs, may need to work outside of office hours. Ability to train other colleagues in job specific skills Good Communication skills. Must have drive to achieve results. Able to work in a multi-disciplined environment and work with many different departments. Support of external company enterprises.


EDUCATION / QUALIFICATIONS

ONC/BTEC/HNC. Must be willing to undertake further training and development as necessary.


Please send your updated resume to: unitedkingdom@edistaffbuilders.com

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